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Back to 2026-07-23🔷 Technology

Why is a semiconductor giant building a massive plant in Madhya Pradesh?

23 Jul4 min read· 📷 Jonas Svidras

The Madhya Pradesh government signed an agreement on Wednesday with Paras Semiconductors to build a six thousand two hundred crore rupee chip packaging plant. The facility on the Indore-Ujjain corridor boosts India's semiconductor manufacturing.

₹6,200 crore

Total Investment

⏳ Time Machine

How today’s news fits into the bigger picture

  1. 2021

    Semiconductor incentive launch

    India launched a ₹76,000 crore semiconductor incentive scheme to attract global chipmakers.

  2. 2024

    First OSAT approvals

    Gujarat and Assam secured approval for India's first commercial semiconductor assembly plants.

  3. 2025

    Power grid upgradation

    Madhya Pradesh upgraded its industrial corridors with dedicated high-voltage power networks for tech units.

  4. Today

    MP signed a ₹6,200 crore MoU with Paras Semiconductors for an OSAT facility.

  5. What happens next?

    The plant's groundbreaking ceremony on the Ujjain-Indore corridor is scheduled for late 2026.

On Wednesday, the Madhya Pradesh government signed a landmark Memorandum of Understanding with Paras Semiconductors to establish a six thousand two hundred crore rupee Outsourced Semiconductor Assembly and Test facility. This advanced facility will be built along the rapidly growing Ujjain-Indore industrial corridor. An OSAT plant is critical because it takes raw silicon wafers manufactured abroad, tests them, and packages them into finished microchips used in cars, smartphones, and industrial machinery. By attracting this high-tech investment, Madhya Pradesh is positioning itself as an emerging alternative hub to traditional electronics manufacturing states like Karnataka and Tamil Nadu. The project is expected to create thousands of highly skilled engineering jobs and attract a cluster of auxiliary electronic component suppliers to the region, accelerating India's drive to build a domestic chip ecosystem.

💭 If you're wondering…

A semiconductor fab prints microscopic circuits onto raw silicon wafers, a highly complex process. An OSAT plant takes these finished wafers, cuts them, tests them, and packages them so they can be mounted onto circuit boards.

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