Prime Minister Narendra Modi inaugurated Micron Technology's semiconductor Assembly, Test, and Packaging (ATMP) facility in Sanand, Gujarat, on Sunday. This **$2.75 billion** investment marks a pivotal moment for India's ambition to become a global hub.
$2.75 billion
Micron Investment
₹ Equivalent: ₹22,500 crore→$2.75 billion
⏳ Time Machine
How today’s news fits into the bigger picture
December 2021
Semiconductor Policy Launched
The Indian government unveiled its 'Modified Programme for Semiconductors and Display Manufacturing Ecosystem,' a ₹76,000 crore incentive scheme to attract chip makers.
June 2023
Micron Announces India Investment
Micron Technology announced its plans to invest $2.75 billion in a semiconductor ATMP facility in Gujarat, becoming the first major global chipmaker to commit to India under the new policy.
September 2025
Construction Begins in Sanand
Groundbreaking ceremony held, and construction officially began for Micron's semiconductor facility in Sanand, Gujarat, marking tangible progress on the project.
Today
PM Modi inaugurated Micron Technology's semiconductor ATMP facility in Sanand, Gujarat.
What happens next?
The first phase of the Micron facility is expected to become operational by early 2027, with production ramping up subsequently.
Prime Minister Narendra Modi officially inaugurated Micron Technology's state-of-the-art semiconductor Assembly, Test, and Packaging (ATMP) facility in Sanand, Gujarat, on Sunday, September 27, 2026. This significant event marks a crucial step in India's journey to establish itself as a major player in the global semiconductor ecosystem. Micron is investing **$2.75 billion (approximately ₹22,500 crore)** in this plant, which is projected to create **5,000 direct jobs** and **15,000 indirect jobs** over the coming years. The facility will be instrumental in processing memory chips for various applications, reducing India's reliance on foreign imports.
💭 If you're wondering…
ATMP stands for Assembly, Test, and Packaging. It's a crucial part of semiconductor manufacturing where the raw silicon wafers are cut into individual chips, assembled into their protective cases, and then thoroughly tested before being sent for use in electronic devices.
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