Paras Semiconductors has partnered with US-based BroadPak to build advanced semiconductor packaging capabilities in India. This collaboration aims to establish a crucial OSAT facility, bolstering India's ambitious chip manufacturing goals.
3D Packaging
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How today’s news fits into the bigger picture
2021
India Semiconductor Mission Launched
The Indian government launched the India Semiconductor Mission (ISM) with a significant financial outlay (initially ₹76,000 crore) to attract investments in semiconductor and display manufacturing, marking a serious push into the sector.
January 2022
First PLI Scheme for Semiconductors Approved
The Union Cabinet approved a comprehensive Production Linked Incentive (PLI) scheme for semiconductors and display manufacturing, offering incentives of up to 50% of the project cost to companies setting up fabs or OSAT units in India.
May 2023
Micron Announced India Fab
US-based Micron Technology announced plans to set up a semiconductor assembly and test facility in Gujarat with an investment of $2.75 billion. This was a major breakthrough, signaling global interest in India's semiconductor ambitions.
June 2025
Tata-PSMC JV Approved for Fab Plant
The Indian government approved a joint venture between Tata Electronics and Taiwan's Powerchip Corp (PSMC) to set up a chip fabrication plant in Gujarat, further diversifying India's fab ecosystem.
September 2026
Government Expands PLI Benefits for Components
The government expanded the scope of PLI schemes to include a wider range of electronics components and sub-assemblies, aiming to build a deeper supply chain and support the entire manufacturing ecosystem, including .
Today
Paras Semiconductors partnered with US-based BroadPak to build advanced semiconductor packaging capabilities in India.
What happens next?
The new advanced OSAT facility is expected to begin construction and progressively ramp up operations, with specific timelines likely announced in the next 12-18 months, attracting further investment into India's semiconductor sector.
India's ambition to become a global semiconductor manufacturing hub just got a significant boost. Paras Semiconductors has announced a strategic partnership with US-based BroadPak to establish advanced semiconductor packaging capabilities within the country. This collaboration focuses on building an **advanced heterogeneous integration and 3D packaging OSAT (Outsourced Semiconductor Assembly and Test) facility**. This type of facility is critical for the final stages of chip production, where individual components are assembled and tested, a segment currently lacking advanced infrastructure in India. The partnership leverages BroadPak's expertise in cutting-edge packaging technologies, directly aligning with the Indian government's Production Linked Incentive (PLI) schemes designed to attract investments across the semiconductor value chain. This move is expected to reduce India's reliance on foreign nations for chip packaging and enhance its position in the global semiconductor supply chain.
💭 If you're wondering…
An OSAT (Outsourced Semiconductor Assembly and Test) facility is where semiconductor wafers are cut into individual chips, packaged into protective casings, and tested for functionality. It's crucial because chips can't be used without packaging, and advanced packaging techniques significantly impact chip performance and size.
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